A report by The Information claims that the world’s biggest chipmaker is considering adding memory back into its portfolio, starting with next-generation 3D DRAM.
With demand still outpacing supply and prices sky-high, the outlet says it could compete with memory giants Micron, Samsung, and SK Hynix to develop and produce 3D DRAM technology that stacks chips vertically for increased bandwidth, capacity, and power efficiency.
[Link: TSMC Weighs Making Advanced Memory Chips to Capture More AI Spending | https://www.theinformation.com/articles/tsmc-weighs-making-advanced-memory-chips-capture-ai-spending?rc=v4bmzs | The Information]
I agree that more supply would be great and building factories can pay off. It’s still very expensive though, and some banks are growing skeptical of the ballooning costs of AI-related projects.